Power Semiconductor

Direct Copper Bonding &
Active Metal Brazing

DCB

Direct Copper Bonding

Insulation board for heat dissipation using thermo-module manufacturing technology

DCB (Direct Copper Bonding) board is an electronic component that forms a copper circuit by directly bonding a copper plate to a ceramics substrate such as alumina or aluminum nitride.
It is widely used in power devices that require efficient heat dissipation as well as electrical insulation.
The use of modular products for automobiles as well as for industrial and commercial use will continue to expand.

AMB

Active Metal Brazing

AMB board for power semiconductors.
High reliability is achieved by the active metal brazing method.

High reliability is achieved by the active metal brazing method.
The SiN-AMB board has no concern about environmental performance and electromigration, and the heat cycle test ensures high reliability without peeling and cracking of the copper plate even after 3000 cycles.