Thermo-electric Modules

Multi-Stage Thermo-electric Modules

The Multi-Stage TEM series is designed to provide significantly higher Δ T

Features

These modules are suitable for local cooling at low temperatures.Typical applications include infrared sensors, CCDs, and optical equipment.
At your request, we can also customize this series to any shape, size, or performance.

Example of usage

  • Optical field/High-sensitivity CCD temperature control, etc.

Specification

2-Stage type

Product name Imax(A) Vmax(V) △Tmax(℃) Qcmax(W) External dimensions (mm) PDF
W1 W2 L1 L2 T Characteristic Drawing
2020/190/016BN 1.6 17.2 104 11.0 14.8 29.8 29.8 29.8 7.75
2020/038/048M 4.8 4.1 105 4.0 11.5 15.1 11.5 15.1 5.40
2020/110/050A 5.0 12.4 114 9.7 14.0 14.0 27.0 27.0 2.65
2020/088/055B 5.5 11.1 105 13.0 15.2 29.8 15.2 29.8 7.00
2020/147/055BN 5.5 12.4 95 29.7 25.0 30.0 25.0 30.0 4.74
2020/324/060BS 6.0 28.2 98 69.0 40.0 40.0 40.0 40.0 5.50
2020/185/065B 6.5 17.9 100 37.0 29.8 39.7 29.8 39.7 6.65
2020/197/070B 7.0 17.8 91 43.0 29.8 39.7 29.8 39.7 4.65
2020/157/070B 7.0 17.3 106 24.0 20.0 39.7 20.0 39.7 6.65
2020/197/080B 8.0 17.8 91 52.0 29.8 39.7 29.8 39.7 6.00
2020/094/230B 23.0 8.2 88 74.0 45.2 - 54.1 - 7.30

● We are pleased to inform you of the specification diagram and characteristic diagram of each Thermo-electric Modules

33-Stage type段タイプ

Product name Imax(A) Vmax(V) △Tmax(℃) Qcmax(W) External dimensions (mm) PDF
W1 W2 W3 L1 L2 L3 T Characteristic Drawing
2030/099/043MN 4.3 8.1 117 6.1 8.6 12.7 21.7 13.0 19.4 28.3 10.40
2030/119/045B 4.5 8.6 111 9.7 15.2 20.0 29.8 15.2 20.0 29.8 9.10
2030/228/045B 4.5 16.4 111 18.0 20.0 29.8 39.7 20.0 29.8 39.7 9.50
2030/106/047MN 4.7 9.3 123 7.0 8.6 13.0 21.7 13.0 21.9 28.3 8.42
2030/106/055A 5.5 9.6 111 8.7 8.6 13.0 21.7 13.0 21.9 28.3 6.75
2030/228/060B 6.0 18.3 111 22.0 20.0 29.8 39.7 20.0 29.8 39.7 8.55

● We are pleased to inform you of the specification diagram and characteristic diagram of each Thermo-electric Modules

Substrate Specification

  • B:High precision surface ceramic substrate product,
    Module thickness tolerance ±0.10mm
  • C:Heat absorption side surface metallized substrate,
    Module thickness tolerance ±0.35mm
  • H:Heat dissipation side surface metallized substrate,
    Module thickness tolerance ±0.35mm
  • M:Heat absorption side/heat dissipation side surface metallized substrate,
    Module thickness tolerance ±0.35mm

*C, H and M types have different thickness methods.

Double-stage shape 1

Double-stage shape 2

Triple-stage shape 3