WATER-COOLED HEAT SINK
As a result of the increased capacity of water-cooled heat sink devices, air cooling methods are about to reach their limits. Our oxygen‐free copper water-cooled heat sinks have a thickness of 6 to 20mm, about 1/10 of air cooled heat sinks. Their cooling effect per unit area is several times that of air cooled heat sinks, resulting in space saving.
Power devices such as thyristors and IGBTs, high frequency devices such as SITs and FETs, resistive elements, CPUs, Peltier devices, various types of lasers, mounted substrates, and other heating elements.
The thickness of 6 to 10 mm contributes to the weight reduction of equipment.
Both sides type
Heating elements can be attached on both faces for space saving.